Grounding scheme for high speed probing with reduced loop area

Details Grounding scheme for high speed probing with reduced loop area Grounding scheme for high speed probing with reduced loop area

2006-10-12

2008-11-11

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S758010

Reexamination Certificate

active

07449901

ABSTRACT:
A grounding scheme for improved high speed probing of a system-under-test (“SUT”) using a ground rail positioned on the SUT near each side of a package attached to the SUT having signal access points, whereby each of the ground rails are electrically connected to a ground access point of the SUT. The signal access points may be pins on a conventionally-mounted or surface-mounted package attached to a printed circuit board (“PCB”) and may be tested with a probe where the ground pin of the probe is movably connected to each ground rail. The ground rails may also be incorporated within an integrated circuit (“IC”) attached to the SUT.

REFERENCES:
patent: 4336496 (1982-06-01), Schnabl et al.
patent: 7161365 (2007-01-01), Gluch et al.
patent: 2006/0087314 (2006-04-01), Zhu et al.
patent: 2007/0126416 (2007-06-01), Zhu et al.

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