Grounding mechanism retention feature

Details Grounding mechanism retention feature Grounding mechanism retention feature

2005-02-22

2005-02-22

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C174S034000, C361S719000

Reexamination Certificate

active

06858796

ABSTRACT:
An electromagnetic (EM) shielding assembly includes an electrically conductive shielding portion and one or more electrically conductive protrusions for engaging with respective conductive apertures in a circuit board. The electrically conductive protrusions can be in electrical communication with the EM shielding portion. The protrusions can enable the EM shielding assembly to be attached to a circuit board in a computer system while also providing an electrical connection to logical ground. Further components, for example a heat sink that may be in electrical communication with the EM shielding portion, may thereby also be connected to logical ground.

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patent: 6590784 (2003-07-01), Wortman et al.
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