Grounding device for bundled cables

Details Grounding device for bundled cables Grounding device for bundled cables

2007-10-30

2007-10-30

Nguyen, Chau N. (Department: 2831)

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

C174S08800C

Reexamination Certificate

active

11523108

ABSTRACT:
A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.

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patent: 2005/0263316 (2005-12-01), Matsumo
patent: 2006/0234556 (2006-10-01), Wu

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