Grounding contact for high speed, high density connector

Details Grounding contact for high speed, high density connector Grounding contact for high speed, high density connector

1998-04-22

1999-12-07

Gellner, Michael L.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

439637, H01R 909

Patent

active

059973129

ABSTRACT:
A grounding contact (1) for inducing noise on a pair of contacts (215) in a high speed, high density electrical connector (2) to ground includes a first section (10) and a second section (11) separated from each other. The first section (10) includes a contact portion (102) for engaging with a daughter board (40) inserted into the connector (2), a fitting portion (104) interferentially engaging with a housing (201) of the connector (2), and a terminal portion (12) to be fitted into a hole of a printed circuit board. The second section (11) includes a contact portion (112) for engaging with the daughter board (40), a fitting portion (114) interferentially engaging with the housing (201) of the connector (2), and a terminal portion (13) for engaging the terminal portion (12) and joining the two sections (10, 11) of the grounding contact (1) together.

REFERENCES:
patent: 5024609 (1991-06-01), Piorunneck
patent: 5496180 (1996-03-01), Fabian et al.

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