Grounding an ultra high density pad array chip carrier

Details Grounding an ultra high density pad array chip carrier Grounding an ultra high density pad array chip carrier

1989-05-01

1991-12-31

Thompson, Gregory D.

Electricity: electrical systems and devices

Miscellaneous

174255, 174260, 361417, 361420, H05K 710

Patent

active

050776339

ABSTRACT:
A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and the conductive runner (104).

REFERENCES:
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4626309 (1986-12-01), Mullen, III et al.
patent: 4631639 (1986-12-01), Biraud
patent: 4700276 (1987-10-01), Freyman et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4787853 (1988-11-01), Igarashi
I.E.E.E. Spectrum, Reed Bowlby, Jun. 1985, pp. 37-42.

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