Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-12-03
2000-10-31
Nguyen, Tan
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174 163, 361212, 361220, 361222, 361707, 439507, 439508, 439509, 439510, 165 803, 165185, H01L 2302
Patent
active
061405817
ABSTRACT:
An electrically grounded semiconductor structure is embedded in a non-conductive packaging material, without employing any electrical leads of the semiconductor structure as an electrical path and without damaging the semiconductor structure. The desired grounding connection is obtained by physically removing a portion of the non-conductive packaging material from a rear portion of the semiconductor structure, replacing the removed non-conductive material by a conformable electrically conductive material, and then electrically contacting this conformable electrically conductive material to a grounding element. In another aspect of the invention, a portion of the non-conductive packaging material is removed from a rear portion of the semiconductor structure and a metallic element such as a pin or a spring is disposed to make contact between the exposed portion of the semiconductor structure and the grounding element.
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Cowan Joseph W.
Schunke J. Neil
Taylor Tom
Mancho Ronnie
Mitsubishi Electronics America Inc.
Nguyen Tan
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