Wave transmission lines and networks – Coupling networks – With impedance matching
Reexamination Certificate
2008-04-23
2010-11-09
Jones, Stephen E (Department: 2817)
Wave transmission lines and networks
Coupling networks
With impedance matching
C174S262000
Reexamination Certificate
active
07830223
ABSTRACT:
High-speed communication links are improved by having differential pairs of traces in a connector pinfield on layers of a multilayer printed circuit board (PCB) to straddle respective rows of reference (ground) pins rather than the respective rows of signal vias. Thus, a desirable increase in the size of each an anti-pad to surrounding each signal via pad can be incorporated without forcing tracing of adjacent differential pairs closer to one another, and thus increased cross talk is avoided. Thereby, 50 ohm or close to 50 ohm impedance for each signal via is achieved. Spacing and routing between traces of each differential pair are advantageously adjusted for skew compensation and impedance optimization utilizing three dimensional computational electromagnetic tools.
REFERENCES:
patent: 6941649 (2005-09-01), Goergen
Cisco Technology Inc.
Jones Stephen E
Schwegman Lundberg & Woessner, P.A.
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