Grooving and glassivating method for semiconductor wafers

Details Grooving and glassivating method for semiconductor wafers Grooving and glassivating method for semiconductor wafers

1978-11-21

1980-12-16

Wojciechowicz, Edward J.

357 45, 357 55, 357 69, H01L 2712

Patent

active

042400953

ABSTRACT:
A method is disclosed wherein grooves between elementary chips of a semiconductive wafer are stepped and then glassivated whereby the glassivation does not raise above the surface of the wafer.

REFERENCES:
patent: 4044454 (1977-08-01), Magdo
patent: 4097890 (1978-06-01), Morris et al.
IBM-Tech. Bul.-vol. 19, No. 12, May 1977, pp. 4596-4597 Antipov.

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