Grooved polishing pad and method

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S527000, C451S528000, C451S533000, C451S921000

Reexamination Certificate

active

06955587

ABSTRACT:
A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries ((168, 172), (312, 316), (412, 416) (508, 512)) having shapes and locations that are a function of the size of polished surface (116) of the article being polished and the type of polisher (100) used. The polishing region has several zones ((Z1–Z3) (Z1′–Z3′)(Z1″–Z3″)(Z1′″–Z3′″)) each containing corresponding grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations selected based on the direction of one or more velocity vectors (V1–V4)(V1′–V4′)(V1″–V4″) (V′″–V4′″) of the wafer in that zone.

REFERENCES:
patent: 5921855 (1999-07-01), Osterheld et al.
patent: 5990012 (1999-11-01), Robinson et al.
patent: 6120366 (2000-09-01), Lin et al.
patent: 6159088 (2000-12-01), Nakajima
patent: 6241596 (2001-06-01), Osterheld et al.
patent: 6315857 (2001-11-01), Cheng et al.
patent: 6354919 (2002-03-01), Chopra
patent: 6520847 (2003-02-01), Osterheld et al.
patent: 6648743 (2003-11-01), Burke
patent: 6729950 (2004-05-01), Park et al.
patent: 6783436 (2004-08-01), Muldowney
patent: 2002-0022198 (2002-03-01), None
US 6,273,808, 08/2001, Bennett et al. (withdrawn)

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Grooved polishing pad and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Grooved polishing pad and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Grooved polishing pad and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3465944

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.