Grooved paths for printed wiring board with obstructions

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174253, 174261, 361777, 361760, 257618, H05K 100

Patent

active

060606657

ABSTRACT:
A printed wiring board employing a grooved path conductive lead configuration. The printed wiring board is formed on a substrate having a surface area. Grooved paths having side walls are formed in the substrate and the sidewalls are coated with a conductive material to form a conductive lead for carrying an electronic signal. The grooved path leads permit closer spacing between adjacent lead pairs without increasing crosstalk between the lead pairs. The grooved path leads also accommodate the inclusion of obstructions such as mounting areas on the substrate because the spacing between adjacent grooved path leads can be condensed without increasing crosstalk levels.

REFERENCES:
patent: 5110298 (1992-05-01), Dorinski et al.
patent: 5286926 (1994-02-01), Kimura et al.
patent: 5286927 (1994-02-01), Ueno et al.
patent: 5451722 (1995-09-01), Gregoire
patent: 5459287 (1995-10-01), Swamy
patent: 5754411 (1998-05-01), Woychik
patent: 5764119 (1998-06-01), Miyagi et al.

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