Grooved package for hybrid components

Details Grooved package for hybrid components Grooved package for hybrid components

1991-02-13

1993-05-25

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 523, 174 521, 361390, 220 402, H01L 2302, H01L 2308, H05K 500

Patent

active

052142469

ABSTRACT:
A package for electronic components and especially hybrid components comprises a base, an enclosure formed by lateral walls and a lid having the function of hermetically sealing the package while bearing on a top end of the lateral walls. At least one lateral wall having through-holes for conductors which serve to establish a connection between the interior of the package and the exterior is provided with at least one longitudinal groove in an upper portion located between the through-holes and the top end of the wall.

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