Groove formed around a semiconductor device on a circuit board

Details Groove formed around a semiconductor device on a circuit board Groove formed around a semiconductor device on a circuit board

2008-05-13

2008-05-13

Sikder, Selina (Department: 2912)

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

Design Patent

active

29240252

CLAIM:
The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

REFERENCES:
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patent: 5777277 (1998-07-01), Inagawa
patent: 5969590 (1999-10-01), Gutierrez
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patent: 6486412 (2002-11-01), Kato
patent: 7126452 (2006-10-01), Teshima et al.
patent: 2006/0266545 (2006-11-01), Takeuchi et al.
patent: 2007/0188287 (2007-08-01), Lien et al.
patent: 2007/0205856 (2007-09-01), Matsunaga et al.
patent: 11-8275 (1999-01-01), None
Offica Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages).
English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page).
English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages).

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