Groove formed around a semiconductor device on a circuit board

Equipment for production – distribution – or transformation of ene – Distribution – modification or control – Semiconductor – transistor or integrated circuit

Design Patent

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Design Patent

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D0567774

CLAIM:
The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

REFERENCES:
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patent: 1263143 (2006-01-01), None
Notification of Reasons for Refusal issued in Japanese Design Application No. 2006-011443 mailed on Nov. 10, 2006 and English translation thereof, 4 pages.
Notification of Reasons for Refusal issued in Japanese Design Application No. 2006-011445 mailed on Nov. 10, 2006 and English translation thereof, 4 pages.
Notification of Reasons for Refusal issued in Japanese Design Application No. 2006-011446 mailed on Nov. 10, 2006 and English translation thereof, 4 pages.

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