Gripper and method for detaching packaged chip from PCB

Metal fusion bonding – With means to cut or separate work – filler – flux – or product – Plus means to apply cut filler or cut flux to work

Reexamination Certificate

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Details

C228S119000, C228S191000, C081S003400, C081S003570

Reexamination Certificate

active

07004371

ABSTRACT:
A gripper for detaching a packaged chip from a PCB. The gripper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook includes a chip-upholding part and a chip-gripping part, wherein the chip-gripping part is used for gripping the packaged chip, and the chip-upholding part is used for hooking the packaged chip in the gap. These elastic slices are used for providing the elasticity. Each elastic slice comprises a fastened end and a flexible end, wherein the flexible end connects the chip-gripping part and results the hook gripping the packaged chip. The heating device is used for heating the packaged chip to melt the solder balls. Wherein all the bonded fastened ends are exerted an upward force, and the gripper detaches the packaged chip from the PCB when the solder balls of the packaged chip are melted.

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patent: 6360940 (2002-03-01), Bolde et al.
patent: 6811072 (2004-11-01), Bolde

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