Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2001-11-15
2004-08-24
Chang, Richard (Department: 3729)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S739000, C029S741000, C029S832000, C294S082230, C294S103100, C294S116000, C294S119100, C294S902000, C901S037000, C901S039000
Reexamination Certificate
active
06779253
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a grip tip of a gripper for a parts having a different shape in a surface mount device, and in particular to an improved grip tip which can be easily attached/detached to/from a gripper for picking up a parts having a different shape, transferring the parts to a printed circuit board, and mounting the parts on the printed circuit board, and which can firmly support the parts, when a surface mount device mounts the parts on the printed circuit board.
2. Description of the Background Art
A surface mount device is used to rapidly precisely mount a plurality of parts on a printed circuit board. A structure of the surface mount device for rapidly precisely mounting parts on the printed circuit board will now be explained with reference to the accompanying drawings.
FIG. 1
is a plan view illustrating the surface mount device. As shown therein, the surface mount device
10
includes an X-Y gantry
11
, a printed circuit board conveyor
12
, a module head
13
and a nozzle exchanging apparatus
14
.
The X-Y gantry
11
transfers the module head
13
in an X-Y axis direction. The module head
13
transferred by the X-Y gantry
11
in the X-Y axis direction transfers a parts to a printed circuit board
1
. The printed circuit board
1
is transferred to a mounting operation position A by the printed circuit board conveyor
12
. When the printed circuit board
1
is transferred to the mounting operation position A by the printed circuit board conveyor
12
, the module head
13
sucks the parts, transfers the parts to the printed circuit board
1
, and mounts the parts on the printed circuit board
1
.
The module head
13
sucking the parts and transferring the sucked parts to the printed circuit board
1
includes a plurality of nozzle devices
20
. A structure of the nozzle device
20
will now be explained with reference to FIG.
2
. Referring to
FIG. 2
, the nozzle device
20
includes a socket unit
21
and a holder unit
22
. The socket unit
21
includes a hollow shaft
21
a
, an assembly block
21
b
, a connection block
21
c
, a socket shaft
21
d
and an elastic member
21
e
. The holder unit
22
includes a holder
22
a
and a holder shaft
22
b.
The hollow shaft
21
a
of the socket unit
21
has a hollow, and the connection block
21
c
is installed by the assembly block
21
b
on the bottom surface of the hollow shaft
21
a
. The holder
22
a
of the holder unit
22
is provided in the connection block
21
c
installed by the assembly block
21
b
. The socket shaft
21
d
and the elastic member
21
c
are disposed at the bottom surface of the connection block
21
c
in order to firmly and detachably support the holder
22
a
installed in the connection block
21
c.
The socket shaft
21
d
of the connection block
21
c
is supported at both side portions of the connection block
21
c
by the elastic member
21
e
. The socket shaft
21
d
installed at both side portions of the connection block
21
c
by the elastic member
21
e
supports both side portions of the holder
22
a
of the holder unit
22
in installation. The holder shaft
22
b
is formed on the bottom surface of the holder
22
a
having its side portions supported by the socket shaft
21
d.
When the holder
22
a
is installed in the connection block
21
c
, a nozzle (not shown) is mounted on the holder shaft
22
b
. In this state, a component is sucked by he nozzle, transferred to the printed circuit board
1
, and mounted thereon. To replace the holder unit
22
, the socket unit
21
is moved to a nozzle exchanging apparatus (
14
in FIG.
1
), and rapidly moved in a vertical direction to pick up the holder unit
22
, thereby mounting and replacing the holder unit
22
. The nozzle (not shown) is mounted inside of the holder shaft
22
b
of the replaced holder unit
22
.
The nozzle is formed to pick up a surface mounting parts having a constant shape and size and to mount the parts on the printed circuit board. Accordingly, a gripper is used to pick up a parts having a different shape and size. However, the conventional gripper does not firmly pick up the parts having the different shape and size, and is not easily attached or detached.
SUMMARY OF THE INVENTION
Accordingly, it is a primary object of the present invention to provide a grip tip which can firmly support a parts having a different shape and which can be easily attached/detached to/from a gripper for the parts having the different shape in a surface mount device, when the gripper mounts the parts on a printed circuit board.
Another object of the present invention is to provide a grip tip which can firmly pick up a parts having a different shape, easily mount the parts on a printed circuit board, and be easily attached/detached to/from a gripper.
In order to achieve the above-described objects of the invention, there is provided, in a surface mount device including a holder mounted in a socket unit to be adhered closely to a socket shaft by an elastic force of an elastic body connected to the socket shaft, a grip tip of a gripper for a parts having a different shape adapted to the surface mount device comprising: a piston installed inside of a through hole formed at the holder, and lifted or lowered by air flown in/out through the through hole; a moving unit adjacently positioned to an inner slanted surface of a slanted member formed on the bottom surface of the piston, and connected to fixed blocks of the holder by a connection means for increasing or decreasing an interval according to the lifting or lowering operation of the piston; and a plurality of grip tips provided to moving blocks of the moving unit through a fixed member, for supporting at least three points of a parts having a different shape.
REFERENCES:
patent: 3204997 (1965-09-01), De Vries
patent: 4593948 (1986-06-01), Borcea et al.
patent: 4607873 (1986-08-01), Nusbaumer et al.
patent: 4680523 (1987-07-01), Goumas et al.
patent: 4831721 (1989-05-01), Hirai et al.
patent: 5125708 (1992-06-01), Borcea et al.
patent: 5190334 (1993-03-01), Sawdon
patent: 5762391 (1998-06-01), Sumnitsch
patent: 5967581 (1999-10-01), Bertini
patent: 6012222 (2000-01-01), Asai et al.
patent: 6334641 (2002-01-01), Oh
patent: 6497440 (2002-12-01), Kim
patent: 33 22 142 (1984-12-01), None
patent: 43 20 071 (1994-01-01), None
patent: 2 263 618 (1994-07-01), None
Fleshner & Kim LLP
Mirae Corporation
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