Grinding process monitoring system and grinding process monitori

Details Grinding process monitoring system and grinding process monitori Grinding process monitoring system and grinding process monitori

1998-01-28

1999-12-14

Bowers, Charles

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 5, 451 8, 451 36, 451286, 451287, 438974, 216 85, 216 88, 156640, B24B 4900, B24C 108, H01L 2100

Patent

active

060009969

ABSTRACT:
A grinding process monitoring system and grinding process monitoring method for monitoring progress of a grinding process by measuring thickness of a film applied to a substrate surface and undergoing the grinding process. A spectrum measuring device for measuring a spectrum of light reflected from the substrate surface has a measuring window opposed to the substrate surface. A measurement region between the measuring window and the substrate surface is filled with a cleaning liquid to form a liquid curtain in the measurement region. While examining bubble characteristic variations occurring in the spectrum due to bubbles present in the measurement region, a moving device is controlled to adjust a spacing between the measuring window and the substrate surface by feedback control to eliminate the bubble characteristic variations. The thickness of the film applied to the substrate surface and undergoing the grinding process is determined, with the spacing between the measuring window and the substrate surface adjusted to eliminate the bubble characteristic variations.

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