Grinding method and grinding device

Details Grinding method and grinding device Grinding method and grinding device

2003-09-12

2008-10-14

Wilson, Lee D (Department: 3723)

Abrading

Machine

Combined

C451S356000, C451S028000, C451S041000

Reexamination Certificate

active

07435164

ABSTRACT:
To grind a peripheral surface of a rotated work (10), by a rotary grindstone (22) rotated by a wheel spindle21, a rotary brush (40) is mounted to one side of the rotary grindstone (22), so that it is rotated along with the rotary grindstone (22). Subsequently to the grinding of the work (10) by the rotary grindstone (22), the rotary grindstone (22) and the work (10) are moved axially relative to each other, and a ground surface of the work (10) is brushed by the rotary brush (40), whereby the polishing of the ground surface of the work (10) is achieved. Thus, the shifting of the work as well as an exclusive deflashing device and an exclusive polishing device are not required, which can contribute to a reduction in machining cost.

REFERENCES:
patent: 5220754 (1993-06-01), Tayebi et al.
patent: 5427644 (1995-06-01), Nagatsuka et al.
patent: 5911257 (1999-06-01), Morikawa et al.
patent: 6120363 (2000-09-01), Dunn
patent: 6173470 (2001-01-01), van Osenbruggen
patent: 2002/0065030 (2002-05-01), Inoue
patent: 2006/0128280 (2006-06-01), Murai
patent: 2006/0166604 (2006-07-01), Murai
patent: 199 13 747 (2000-10-01), None
patent: 63-312055 (1988-12-01), None
patent: 7-24712 (1995-01-01), None
patent: 7-108306 (1995-04-01), None
patent: 7-276197 (1995-10-01), None
patent: 9-300193 (1997-11-01), None
patent: 10-296611 (1998-11-01), None

Affiliated with

Also associated with

Rating

Grinding method and grinding device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Grinding method and grinding device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Grinding method and grinding device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4012579