Grinding method and device for the same

Details Grinding method and device for the same Grinding method and device for the same

2005-08-23

2005-08-23

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S053000, C451S449000

Reexamination Certificate

active

06932673

ABSTRACT:
The present invention supplies coolant to a grinding wheel surface and reliably guides the coolant to a grinding point on the grinding wheel surface, thereby significantly reducing the amount of coolant to be used.In a grinding method and device for supplying coolant while grinding a workpiece W with a rotating grinding wheel1, a fluid nozzle2is disposed upstream from a grinding point11on the circumferential surface10of the grinding wheel1. The fluid nozzle2blows a jet of fluid across an air layer12, which is a layer of flowing air dragged along the circumferential surface10of the grinding wheel1, from one lateral side of the air layer12to the other lateral side thereof. A grinding fluid nozzle3supplies coolant to a region between the grinding point11and a cutoff position13at which the fluid jet from the fluid nozzle2has deflected the air flow from the air layer12. The coolant supplied from the grinding fluid nozzle3contacts the grinding point11on the grinding surface10.

REFERENCES:
patent: 2301069 (1942-11-01), Mulholland
patent: 2899781 (1959-08-01), Williams
patent: 3325949 (1967-06-01), Fisher
patent: 3568377 (1971-03-01), Blohm et al.
patent: 3834088 (1974-09-01), Matson
patent: 4830553 (1989-05-01), Abeyta et al.
patent: 51-146490 (1976-11-01), None
patent: 51-146490 (1976-11-01), None
patent: 361241065 (1986-11-01), None
patent: 02-100770 (1990-08-01), None
patent: 06-008143 (1994-01-01), None
patent: 06-155300 (1994-03-01), None
patent: 10296633 (1998-11-01), None
patent: 02003275958 (2003-09-01), None
Patent Abstract of Japan for JP06-008143 published on Jan. 1, 1994.
Patent Abstract of Japan for JP06-155300 published on Mar. 6,-1994.
Concise explanation of Japanese Laid-Open Utility Model Publication No. Sho 51-146490.
Concise explanation of Japanese Laid-Open Utility Model Publication No. Hei 2-100770.

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