Grinding method

Details Grinding method Grinding method

1975-08-28

1977-04-12

Whitehead, Harold D.

Stone working

Sawing

Rotary

51267, 51283, 51322, B28D 104

Patent

active

040168557

ABSTRACT:
A method for segmenting a plate-like material, particularly a semiconductor wafer on which a plurality of elements are formed in regular arrangement, is provided. Segmentation is performed while flowing a fluid over the entire surface of the plate-like material to wash the surface thereof.

REFERENCES:
patent: 2911773 (1959-11-01), Gobat
patent: 3672099 (1972-06-01), Parkhurst
patent: 3831576 (1974-08-01), Mech

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