Grinding apparatus for wafer edge

Details Grinding apparatus for wafer edge Grinding apparatus for wafer edge

1995-09-12

1997-08-19

Eley, Timothy V.

Abrading

Machine

Combined

451 44, 451194, 451210, 451254, B24B 704, B24B 906

Patent

active

056581890

ABSTRACT:
A slide table is slidably supported on the slide stage which is moved by a guide screw. The slide table is connected with the slide stage by means of pressurization means. A rotatable wafer table is provided on the slide table. A grinding wheel for chamfering is used. The pressurization means is locked, so that the slide table is kept locked to the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is chamfered. A grinding wheel for polishing is used. The pressurization means is not locked, so that the slide table can be slide on the slide stage. A wafer set on the slide table is moved toward the grinding wheel, and an edge of the wafer is polished.

REFERENCES:
patent: 2293291 (1942-08-01), Gaspari
patent: 5056270 (1991-10-01), Curcher
patent: 5097630 (1992-03-01), Maeda et al.

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