Grinding and polishing machines

Details Grinding and polishing machines Grinding and polishing machines

1999-03-19

2000-08-01

Scherbel, David A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 65, B24B 100

Patent

active

060958979

ABSTRACT:
A grinding machine for grinding the edge of a disc or wafer comprises a grooved grinding wheel 308, means for transporting the wafers before or after grinding, and a housing 332 in which wafers 340 are parked on a vacuum chuck 336 awaiting inspection. A jet 338 protrudes into the housing and directs water or air towards the face and edge of the wafer on the chuck. The transport means then transfers wafers to an inspection station.

REFERENCES:
patent: 5185965 (1993-02-01), Ozaki
patent: 5295331 (1994-03-01), Honda et al.
patent: 5609514 (1997-03-01), Yasunaga et al.
patent: 5613894 (1997-03-01), Vedove
patent: 5630746 (1997-05-01), Gottschald et al.
patent: 5658189 (1997-08-01), Kagamida
patent: 5679060 (1997-10-01), Leonard et al.

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