Grid array connection device and method

Details Grid array connection device and method Grid array connection device and method

2011-03-29

2011-03-29

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C257S780000

Reexamination Certificate

active

07915060

ABSTRACT:
A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.

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