Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1994-01-06
1995-11-07
Utech, Benjamin
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4271261, 427367, B05D 512
Patent
active
054646529
ABSTRACT:
The present invention provides a method for metallizing vias in co-fired ceramic green tape. A vacuum operated pick and place anvil comprising a porous block is used to pick up conductor balls from a bed. Air pressure is used to create a vacuum which pulls the conductor balls to the porous block. A stencil having openings is placed on a contact surface of the anvil, thereby permitting only one conductor ball to attach to each opening in the stencil. With the conductor balls attached to the anvil, the anvil is lowered onto the green tape. Next the anvil pushes the conductor balls into the tape until the conductor balls break through the opposite side of the tape. The anvil is retracted leaving the conductor balls lodged in the tape. It is possible to provide a green tape with pre-formed vias so that forcing the conductor balls into the tape is a simpler task. The locations of the openings in the stencil determines the location of the vias or must correspond to the vias in a tape having pre-formed vias. If the conductor balls protrude from any surface of the tape, the anvil or similar device can be used to flatten the protrusion.
REFERENCES:
patent: 3576669 (1971-04-01), Filip
patent: 4183137 (1980-01-01), Lomerson
patent: 4301192 (1981-11-01), Plichta et al.
patent: 4485129 (1984-11-01), Grunwald et al.
patent: 4802945 (1989-02-01), Opina
patent: 5308645 (1994-05-01), Zachman et al.
Brown Raymond
Himmel Richard P.
Denson-Low W. K.
Hughes Aircraft Company
Lachman M. E.
Sales M. W.
Utech Benjamin
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