Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1997-06-23
2000-08-22
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20429834, 20419232, 156345, 216 67, C23F 102, H05H 146
Patent
active
061066834
ABSTRACT:
A device and method for polishing the surface of a substrate uses a vessel for holding a plasma in a magnetic field. Further, the magnetic field is selectively oriented in the vessel relative to the substrate surface. An ion accelerator is then activated to accelerate ions from the plasma on a curved path toward the substrate. By controlling the strength of the magnetic field, and the r-f power and frequency needed to accelerate the ions, the accelerated ions are sent on the curved path for collision with the substrate surface. These collisions, which occur at grazing angles in the range of 0.degree.-20.degree., remove atoms from the substrate surface and thereby polish the surface.
REFERENCES:
patent: 3699334 (1972-10-01), Cohen et al.
patent: 4371412 (1983-02-01), Nishizawa
patent: 4375385 (1983-03-01), Halon
patent: 4381965 (1983-05-01), Maher, Jr. et al.
patent: 4479848 (1984-10-01), Otsubo et al.
patent: 4500409 (1985-02-01), Boys et al.
patent: 4639301 (1987-01-01), Doherty et al.
patent: 4687539 (1987-08-01), Burns et al.
patent: 4704301 (1987-11-01), Bauer et al.
patent: 4734158 (1988-03-01), Gillis
patent: 4780682 (1988-10-01), Politzer
patent: 5016663 (1991-05-01), Mase et al.
patent: 5047115 (1991-09-01), Charlet et al.
patent: 5200023 (1993-04-01), Gifford et al.
patent: 5217560 (1993-06-01), Kurono et al.
patent: 5225740 (1993-07-01), Ohkawa
patent: 5279669 (1994-01-01), Lee
patent: 5328555 (1994-07-01), Gupta
patent: 5350454 (1994-09-01), Ohkawa
patent: 5361016 (1994-11-01), Ohkawa et al.
patent: 5453305 (1995-09-01), Lee
patent: 5540781 (1996-07-01), Yamagami et al.
patent: 5556501 (1996-09-01), Collins et al.
patent: 5571576 (1996-11-01), Quin et al.
patent: 5707486 (1998-01-01), Collins
patent: 5795452 (1998-08-01), Kinoshita et al.
Cantelmo Gregg
Nguyen Nam
Toyo Technologies Inc.
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