Graphite aluminum metal matrix composite microelectronic package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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174 5061, 174 523, 174152GM, H05K 506

Patent

active

059987332

ABSTRACT:
An electronic package includes a graphite-aluminum metal matrix composite (MMC) housing or support member that dissipates heat from an electronic component or circuit and a hermetic glass feedthrough seal between the graphite-aluminum MMC material and one or more electrical feedthrough pins or wires connected to the electronic component. The glass feedthrough seal comprises a low melting point, low coefficient of expansion (CTE) solder glass, such as lead zinc borosilicate, effective to form a hermetic glass-to-composite seal by a combined chemical and mechanical compression sealing force. The vitreous solder glass preferably exhibits a CTE in the range of about 41 to about 78 ppm/degree C. and a melting temperature in the range of about 300 to about 500 degrees C.

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patent: 5163499 (1992-11-01), Newkirk et al.
patent: 5227587 (1993-07-01), Paterek
patent: 5347426 (1994-09-01), Dermarkar et al.

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