Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-22
2008-01-22
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S699000, C361S700000, C165S080300, C165S080400, C165S185000
Reexamination Certificate
active
11304457
ABSTRACT:
A cooling mechanism to dissipate thermal energy generated by the active electronic components of a graphics card assembly. A mechanism includes a radiator and a metal block that is thermally coupled to the active electronic components and that has a tubing therewithin. The radiator includes a pipe and baffles attached to the pipe, where one end of the pipe is connected to one end of the tubing. A pump, connected to the other ends of the tubing and pipe, circulates coolant through the pipe and tubing to transfer thermal energy from the metal block to the radiator. The mechanism also includes a heat sink that is thermally coupled to the metal block via a thermal transfer plate. A fan unit of the mechanism generates and directs an air flow toward the radiator, metal block and heat sink, where the air flow removes the thermal energy therefrom.
REFERENCES:
patent: 6029742 (2000-02-01), Burward-Hoy
patent: 6452797 (2002-09-01), Konstad
patent: 6587343 (2003-07-01), Novotny et al.
patent: 6671177 (2003-12-01), Han
patent: 7151667 (2006-12-01), Walters et al.
patent: 2006/0164808 (2006-07-01), Stefanoski
patent: 02004251474 (2004-09-01), None
Buchanan Ingersoll & Rooney LLP
Datskovskiy Michael
EVGA Corporation
Wilson R.
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