Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1995-09-28
2000-10-03
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 87, 156281, 156285, 148DIG135, 438455, B32B 3116, H01L 21304
Patent
active
RE0368903
ABSTRACT:
An apparatus and method for improved wafer bonding by scrubbing, spin drying, aligning, and pressing the polished wafers together. The first wafer (13) is mounted on a flat wafer chuck (11) and a second wafer (14) is mounted on a convex pressure gradient chuck (10). Wafers are scrubbed until a polished contamination free surface is obtained and pressed together. The convex pressure gradient chuck exerts a higher pressure at the center of the wafer than at the periphery of the wafer.
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Secco d'Aragona Frank T.
Wells Raymond C.
Aftergut Jeff H.
Barbee Joe E.
Cooper Kent J.
Motorola Inc.
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