Graded extended drain concept for reduced hot electron effect

Fishing – trapping – and vermin destroying

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437 41, 437 26, 437 27, 437 28, 437 29, 357 233, H01L 2978, H01L 2936, H01L 298

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048596205

ABSTRACT:
Hot electron injection into the gate oxides of MOSFET devices imposes limitations on the miniaturization of such devices in VLSI circuits. A buried channel with a graded, buried spacer is provided to guard against hot electron trapping effects while preserving process and structure compatibility with micron or submicron VLSI devices. The channel current is redirected into a buried channel at a distance away from the interface in the vicinity of the drain region where the hot electron effect is most likely to occur.

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