Graded composition primer layer

Stock material or miscellaneous articles – All metal or with adjacent metals – Having composition – density – or hardness gradient

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428621, 428626, 428630, 428666, 428674, 428675, 428901, 20419215, 20419217, B32B 1504, C23C 1414

Patent

active

049179632

ABSTRACT:
Bonding between a metallic conductor and a substrate is improved by using a primer layer having a graded composition which continuously varies from a composition predominant in a metal which bonds well to the substrate at the substrate-primer layer interface to a composition predominant in the metal of the conductor at the conductor-primer layer interface. Specifically, the bonding characteristics of copper to polyimide substrate are improved by using a chromium-copper graded composition primer layer which is chromium-rich at the substrate-primer layer interface and copper-rich at the conductor-primer layer interface.

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Hoitt et al., "Metalized Film Flex Circuits Yield Fine Lines," Electronic Packaging & Production, Jun. 1988.
Coutts, Thin Solid Films 4, (1969).
Campbell, "Mechanical Properties of Thin Films", Handbood of Thin Film Tech., Maissel & Glang, Eds., Chapt. 12 (mcGraw Hill 1970).
McIntyre et al., J. Vac. Sci. Technol. A6, 1708 (1988).

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