Games using tangible projectile – Golf – Ball
Reexamination Certificate
2007-08-08
2009-10-27
Trimiew, Raeann (Department: 3711)
Games using tangible projectile
Golf
Ball
Reexamination Certificate
active
07607996
ABSTRACT:
A golf ball is provided with a dimple pattern comprising two substantially identical elongated dimple pattern elements which fit together to form the complete dimple pattern. The dimple pattern can contain 344 dimples covering about 70.4% of the golf ball surface or 392 dimples covering about 73.3%, or other combinations of dimple count and coverage. The sizes of the dimples can be varied among either four distinct dimple sizes ranging from about 0.14 inches to about 0.17 inches or eight distinct dimple sizes ranging from about 0.11 inches to about 0.175 inches, or other dimple size combinations. The arrangement of dimples on the golf ball can be divided into a plurality of triangles having identical dimple arrangements with bilateral symmetry.
REFERENCES:
patent: 5145180 (1992-09-01), Oka
patent: 5156404 (1992-10-01), Oka et al.
patent: 6358161 (2002-03-01), Aoyama
patent: 6390938 (2002-05-01), Asakura et al.
patent: 6610812 (2003-08-01), Wu et al.
patent: 6685580 (2004-02-01), Sullivan
patent: 6692379 (2004-02-01), Morgan et al.
patent: 2002/0165043 (2002-11-01), Winfield
patent: 2003/0045678 (2003-03-01), Keith et al.
patent: 2003/0119606 (2003-06-01), Ohama et al.
patent: 2003/0134695 (2003-07-01), Kasashima
patent: 2003/0157999 (2003-08-01), Yu
patent: 2004/0082407 (2004-04-01), Sullivan et al.
patent: 2004/0082408 (2004-04-01), Sullivan et al.
patent: 2004/0092335 (2004-05-01), Boehm et al.
Aoyama Steven
Tapper Charles J.
Acushnet Company
Milbank Mandi B.
Trimiew Raeann
LandOfFree
Golf ball dimple pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Golf ball dimple pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Golf ball dimple pattern will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4062369