Gold wire for bonding

Details Gold wire for bonding Gold wire for bonding

1996-01-17

1997-12-30

Choi, Kathleen

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Rod, strand, filament or fiber

428606, 420507, 420510, 420511, C22C 502

Patent

active

057028141

ABSTRACT:
According to the present invention provided is a gold wire for IC chip bonding which wire is unlikely to be broken after thermosonic wire bonding at an increased ultrasonic output, subsequent reverse deformation involving severe bonding and deformation of a ball neck portion and formation of a loop. The bonding gold wire essentially consists of 0.0001-0.005 wt % of Pt, 0.0001-0.005 wt % of Ag, 0.0005-0.005 wt % of Mg and 0.00005-0.005 wt % of Eu; with the balance being Au, said Au having less than 0.001% by weight of incidental impurity.

REFERENCES:
patent: 4330329 (1982-05-01), Hayashi et al.
patent: 4775512 (1988-10-01), Fukui et al.
patent: 4885135 (1989-12-01), Hosoda et al.
patent: 4938923 (1990-07-01), Kujiraoka et al.
patent: 5071619 (1991-12-01), Hosoda et al.
patent: 5366692 (1994-11-01), Ogashiwa
patent: 5384090 (1995-01-01), Ogashiwa
Patent Abstracts of Japan, vol. 017, No. 274 (C-1064).
European Search Report and Annex to the Serach Report.
English Language Abstract of Japanese Application No. 5-9624.
English Langauge Abstract of Japanese Application No. 63-145729.
English Langauge Abstract of Japanese Application No. 3-283541.
English Langauge Abstract of Japanese Application No. 61-60842.

Affiliated with

Also associated with

Rating

Gold wire for bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gold wire for bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold wire for bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-200729