Gold-tin-silicon alloy for brazing silicon to metal

Details Gold-tin-silicon alloy for brazing silicon to metal Gold-tin-silicon alloy for brazing silicon to metal

1978-12-12

1980-07-29

Rutledge, L. Dewayne

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

428641, H05K 104, C22C 500

Patent

active

042149045

ABSTRACT:
An alloy for brazing a silicon die to a gold-plate kovar header consists essentially of 19 to 21 weight percent tin and 0.6 to 0.8 weight percent silicon with the balance being gold. The alloy melts at a temperature below 200.degree. C. which is substantially lower than that of the conventional gold-silicon eutectic alloy.

REFERENCES:
patent: 2747971 (1956-05-01), Hein
patent: 3099539 (1963-06-01), Tang
patent: 3158471 (1964-11-01), Kadelburg
patent: 3340602 (1967-09-01), Hontz
patent: 3579312 (1971-05-01), Short
patent: 3769006 (1973-10-01), Ingersoll
patent: 3956098 (1976-05-01), Welch et al.

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