Gold-tin-gold ohmic contact to N-type group III-V semiconductors

Coating processes – Electrical product produced – Condenser or capacitor

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29590, 357 17, 357 67, 357 71, 427 85, 427 87, 427 90, 427 91, 427383D, H01L 2348

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041795342

ABSTRACT:
A semiconductor device with a low resistance ohmic contact, strongly adherent to the n-type surface of a body (11) of Group III-V compound semiconductor is obtained by a process including the sequential deposition of gold (13), tin (14) and gold (15) at a surface temperature of less than 200 degrees C followed by a heat treatment in a nonoxidizing atmosphere. This process has shown particular advantage when applied to aluminum containing compound semiconductors (e.g., gallium aluminum arsenide). For such use an initial deposition of aluminum (16) has proven particularly successful in producing consistently low resistance ohmic contacts. The invention has been used in the production of light emitting diodes.

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patent: 3890699 (1975-06-01), Vilms
patent: 3942243 (1976-03-01), Murray
patent: 3959522 (1976-05-01), Ladany et al.
patent: 4011583 (1977-03-01), Levinstein et al.
patent: 4081824 (1978-03-01), Keramidas
Paola, "Metallic Contacts for Gallium Arsenide", Solid-State Electronics, vol. 13, pp. 1189-1197 (1970).
Rideout, "A Review of the Theory and Technology for Ohmic Contacts to Group III-V Compound Semiconductors", Solid-State Electronics, vol. 18, pp. 541-550 (1975).
Buene et al., "Alloying Behavior of Au-In and Au-Sn Films on Semiconductors", Thin Solids Films, vol. 34, pp. 149-152 (1976).
Shih et al., "Contact Resistances of Au-Ge-Ni, Au-Zn and Al to III-V Compounds", SSE vol. 15, No. II-A, pp. 1177-1180, 1972.

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