Metal working – Method of mechanical manufacture – Electrical device making
Patent
1989-11-28
1991-04-23
Gorski, Joseph M.
Metal working
Method of mechanical manufacture
Electrical device making
29840, 2281802, 437209, B23K 3102, H01L 2348, H01L 2954
Patent
active
050089978
ABSTRACT:
An improved tape automated bonding method of bonding the beam leads of lead frame tape to gold bumps formed on the contact pads of a semiconductor device, wherein the tape includes a plurality of interconnected beam leads defined by at least one opening in the tape such that each beam lead has an inner end and an outer end. The method includes the steps of depositing a gold layer on the beam leads, masking a region of each beam lead from further deposition of material such that a predetermined portion of each beam lead is exposed for further deposition of material, depositing a predetermined amount of tin on the exposed portion of each beam lead, establishing contact between each beam lead and the die bump to which each beam lead is to be bonded and applying a predetermined amount of pressure and heat to form a bond between each beam lead and the die bump to which the beam lead is to be bonded such that the bond formed includes the primary eutectic of the combination of tin and gold.
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Gorski Joseph M.
Heslin James M.
National Semiconductor
Patch Lee
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