Gold solders

Details Gold solders Gold solders

1983-02-16

1984-04-24

Rutledge, L. Dewayne

Alloys or metallic compositions

Gold base

Silver containing

420587, C22C 502

Patent

active

044447191

ABSTRACT:
This gold solder comprises an Au-Cu-Ag-Ge alloy with 3 to 6% germanium and has a melting temperature of 800.degree. C. or below. The gold content of the gold solder is 50 to 70% equivalent to 12 to 16 Karat. The gold solder that exhibits corrosion resistance corresponding to that of materials such as a gold alloy, stainless steel, stellite and sintered carbide makes it possible to solder at 800.degree. C. or below ornamental parts made of the above materials. As a result, any surface degradation is prevented during the soldering process of mirror-polished ornamental parts.

REFERENCES:
patent: 219097 (1879-09-01), Hubbell
patent: 4297416 (1981-10-01), Krug et al.
patent: 4330329 (1982-05-01), Hayashi et al.

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