Gold plating with electrochemical passivation

Details Gold plating with electrochemical passivation Gold plating with electrochemical passivation

1977-07-22

1978-05-23

Andrews, R. L.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

C25D 1134

Patent

active

040909344

ABSTRACT:
A process is described for making gold platings of low effective porosity. This process involves first putting down a gold layer on a surface and then passivating the surface using an electrochemical procedure. This process permits use of much thinner gold layers than ordinarily used without the danger of corrosion of underlying base metal.

REFERENCES:
patent: 3700469 (1969-10-01), Okinaka
"Gold Plating Technology", by F. H. Reid, et al., Electrochem. Publications Ltd., 1974, Chapters 3, 5-6.
Modern Electroplating, by F. A. Lowenheim, 3rd Ed., Chapter 8.

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