Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Utilizing nonaqueous bath
Reexamination Certificate
2004-09-10
2008-08-05
Tsang-Foster, Susy (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Utilizing nonaqueous bath
C205S247000, C205S267000
Reexamination Certificate
active
07407569
ABSTRACT:
A gold plating solution comprising iodide ions, gold iodide complex ions and a non-aqueous solvent, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution. The present invention further provides a gold plating solution comprising iodide ions, gold iodide complex ions, a non-aqueous solvent and a water-soluble polymer, which is less toxic and stable, while having a performance comparable to a cyanide type gold plating solution and which is capable of forming a gold plating film in which gold crystal particle sizes are very fine and grain boundaries are dense. The present invention further provides a gold plating method employing such a gold plating solution.
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Ishikawa Makoto
Kawase Yasuhiro
Mizutani Fumikazu
Takaha Hiroshi
Leader William T.
Mitsubishi Chemical Corporation
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Tsang-Foster Susy
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