Gold plating composition and method

Details Gold plating composition and method Gold plating composition and method

1979-04-05

1980-04-08

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 362

Patent

active

041971728

ABSTRACT:
A bath for electroplating hard gold deposits at relatively high current efficiencies comprises an aqueous solution of an alkali metal dihydrogen phosphate, nitrilotris(methylene) triphosphonic acid, a nickel and/or cobalt phosphate compound, triethanolamine borate, alkali metal gold cyanide and a small amount of free alkali metal cyanide. The bath is maintained at a pH of 3.8-4.5 and operated at a current density of 0.1-20 amperes per square decimeter.

REFERENCES:
patent: 3706634 (1972-12-01), Kowalski
patent: 3770596 (1973-11-01), Bick et al.
patent: 3856638 (1974-12-01), Bick et al.
patent: 3904493 (1975-09-01), Losi et al.
patent: 4073700 (1978-02-01), Weisberg et al.
patent: 4076598 (1978-02-01), Lerner et al.

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