Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate
Patent
1991-02-01
1993-01-05
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly nonmetal substrate
205266, 205926, 205920, C25D 348, C25D 554, C25D 712
Patent
active
051768119
ABSTRACT:
Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, modified by the addition of an effective amount of NH.sub.4.sup.+.
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Principles of Electronic Packaging-"Polymers and Polymer-Based Composites for Electronic Applications" Appelt et al.; pp. 334-371.
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Microelectronics Packaging Handbook-"Printed-Circuit Board Packaging" D. P. Seraphim et al.; pp. 853-921.
Microelectronics Packaging Handbook-"Chip-To-Package Interconnections", N. G. Koopman et al.; pp. 361-453.
Keim Leann G.
Paonessa Ralph S.
Van Hart Daniel C.
Bolam Brian M.
Goldman Richard M.
International Business Machines - Corporation
Niebling John
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