Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
1999-04-19
2001-03-20
Jones, Deborah (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S647000, C428S672000, C228S056300
Reexamination Certificate
active
06203929
ABSTRACT:
BACKGROUND
The present invention is directed to the field of microelectronic packaging and, more particularly, to a gold plated solder material and a method of fluxless soldering attachment using the solder material.
Different types of components are commonly attached to substrates in microelectronic assemblies such as hybrid packages using eutectic attachment techniques. In a given hybrid package, different types of components are commonly attached to a substrate using different solder compositions. Typical metal alloy solder compositions that are used include gold-based alloys such as Au-Si, Au-Ge and Au-Sn. Such gold-based alloys do not oxidize in air and, consequently, do not require the use of fluxes to dissolve oxides and enable wetting of the joined surfaces. Fluxes are undesirable in soldering hybrid packages, however, due to the detrimental effects fluxes can have on certain components such as micro-optoelectronic devices.
Known gold-based solder compositions represent a range of eutectic temperatures. The different types of components in hybrid packages typically have upper temperature limits to which they can be heated during soldering without degrading the components. To avoid such degradation, the components are attached to the substrate using a soldering hierarchy approach, in which the components are soldered in the order of descending temperature resistance using different solder compositions in the order of descending processing temperature. For example, 96.4% Au-3.6% Si has a eutectic temperature of about 370° C. and is typically heated to a processing temperature of about 390-420° C. to form a eutectic bond between the component and the substrate. Components having an upper temperature limit above this processing temperature are attached first to the substrate using Au-Si solder. Au-Ge solder has a eutectic temperature below that of Au-Si solder and above that of Au-Sn solder. Accordingly, components having a temperature upper limit below the Au-Si solder process temperature range and above the Au-Sn process temperature are next attached to the substrate using the Au-Ge solder. This process is repeated until the soldering hierarchy is completed.
The present gold-based solders are less than completely satisfactory because they cannot be used in microelectronic assemblies such as hybrid packages to attach components having an upper temperature limit below the process temperature of Au-Sn solders. 80% Au-20% Sn solder has a eutectic temperature of about 280° C. and typically is heated to about 310-330° C. during soldering to ensure complete melting occurs. This processing temperature range can degrade some components.
Conventional solder compositions such as Sn-Pb solders have a sufficiently low process temperature for attaching such components, but these solders require fluxes to form a satisfactory joint. Accordingly, these solders are not suitable for use in hybrid packages that include micro-optoelectronic devices which can be degraded by fluxes.
Thus, there is a need for a solder composition and a method of using the solder composition to attach a component to a substrate in a microelectronic assembly such as a hybrid package that (i) does not require a flux; and (ii) melts at a relatively low temperature, making it suitable for attaching components at lower process temperatures than can be used for known gold-based solders.
SUMMARY
The present invention provides a solder material and a method of fluxless soldering attachment of a component to a substrate in a microelectronic assembly such as a hybrid package using the solder material that satisfies the above-described needs. The solder material comprises a core and a layer of gold covering at least a portion of the core. The core can comprise tin, lead and small amounts of other elements such as silver. The alloy preferably consists essentially of at least about 30 wt. % tin and the balance lead. This composition melts at temperatures of less than about 250° C. The solder material comprising this core composition can be heated to a temperature of less than about 280° C. to melt the core alloy and form a solder joint. The alloy preferably consists essentially of a eutectic composition of about 63 wt. % tin and about 37 wt. % lead that melts at the eutectic temperature of about 183° C. The solder material comprising this core composition can be heated to a low process temperature of less than about 230° C. to join the component and the substrate. Heating of the solder material is preferably conducted in an inert gas atmosphere.
The gold layer is preferably applied on the core using an electroless plating process. Electroless plating provides a gold layer having excellent coverage and thickness uniformity. The component and the substrate typically each also have a gold layer to prevent surface oxidation. The solder material has an effective thickness to provide a joint between the component and the substrate comprising less than about 3 wt. % gold. Higher percentages of gold can degrade the mechanical properties of the joint.
The method of attaching the component to the substrate in the microelectronic assembly comprises placing the solder material between the component and the substrate and heating the solder material to an effective temperature to melt the solder material and form a solder joint. The effective temperature depends on the composition of the core. The joint preferably comprises less than about 3 wt. % of gold.
Thus, the present solder material and method of attaching a component to a substrate in a microelectronic assembly (i) enables fluxless soldering; (ii) has a relatively low process temperature, making it suitable for attaching components in hybrid packages at lower temperatures than can be used for known gold-based solders; and (iii) forms a joint having a controlled gold content.
REFERENCES:
patent: 2503564 (1950-04-01), Reeve
patent: 3392442 (1968-07-01), Napier et al.
patent: 4645116 (1987-02-01), Henein et al.
patent: 4817849 (1989-04-01), Yamamoto et al.
patent: 5086966 (1992-02-01), Melton et al.
patent: 5341980 (1994-08-01), Nishikawa et al.
patent: 5384204 (1995-01-01), Toshihiko et al.
patent: 5622305 (1997-04-01), Bacon et al.
patent: 5816473 (1998-10-01), Nishikawa et al.
patent: 5878943 (1999-03-01), Nishikawa et al.
patent: 6037065 (2000-03-01), Hajmrie et al.
patent: 6119920 (2000-11-01), Guthrie et al.
patent: 2036794 (1980-07-01), None
patent: 2221570 (1990-02-01), None
patent: 61137697 (1996-06-01), None
Goldman Ronald M.
Jones Deborah
Savage Jason
TRW Inc.
Yatsko Michael S.
LandOfFree
Gold plated solder material and method of fluxless soldering... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Gold plated solder material and method of fluxless soldering..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold plated solder material and method of fluxless soldering... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2470382