Gold paste for a ceramic circuit board

Details Gold paste for a ceramic circuit board Gold paste for a ceramic circuit board

1997-07-07

2000-07-18

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427125, 4273766, 4273767, 4274191, B05D 512

Patent

active

060904364

ABSTRACT:
An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle size of 0.3-0.7 .mu.m, (b) 0.3-2.0 wt % powdery V.sub.2 O.sub.5 with a particle size of 0.3-2.0 .mu.m, and (c) 0.3-2.0 wt % powdery CuO with a particle size of 0.3-2.0 .mu.m.

REFERENCES:
patent: 2525209 (1950-10-01), Davis
patent: 3021233 (1962-02-01), Fenity
patent: 3440182 (1969-04-01), Hoffman
patent: 3480566 (1969-11-01), Hoffman
patent: 3516949 (1970-06-01), Hoffman
patent: 3960777 (1976-06-01), Coyle
patent: 3969570 (1976-07-01), Smith
patent: 4004057 (1977-01-01), Hoffman
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 5066620 (1991-11-01), Sunahara

Affiliated with

Also associated with

Rating

Gold paste for a ceramic circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gold paste for a ceramic circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold paste for a ceramic circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2034062