Gold-palladium-nickel-copper-manganese filler metal for joining

Details Gold-palladium-nickel-copper-manganese filler metal for joining Gold-palladium-nickel-copper-manganese filler metal for joining

1988-03-28

1989-06-13

Rutledge, L. Dewayne

Alloys or metallic compositions

Containing over 50 per cent metal but no base metal

Copper containing

22826318, 428593, 428668, C22C 3002

Patent

active

048391417

ABSTRACT:
A brazing alloy system having a brazing temperature of 1025.degree. to 1080.degree. C., a solidus temperature above 1000.degree. C., a liquidus temperature above 1018.degree. C., consisting of, in weight percent, 5-30 Au, 15-35 Pd, 10-30 Ni, 20-48 Cu, and 15-25 Mn. Preferred brazing alloys are (1) 25 Au, 15 Pd, 18 Ni, 31 Cu, and 11 Mn, (2) 5 Au, 30 Pd, 10 Ni, 40 Cu, and 15 Mn, and (3) 15 Au, 20 Pd, 13 Ni, 41 Cu, and 11 Mn.
A method of joining superalloy parts using these alloys as a braze is disclosed, as well as a panel made of a honeycomb structure of thin superalloy metal sandwiched between two sheets of superalloy and brazed with these alloys.

REFERENCES:
patent: 388145 (1888-08-01), Heinrich et al.
patent: 4527998 (1985-07-01), Knemeyer
patent: 4576790 (1986-03-01), Rothaut et al.

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