Gold electroplating solutions and processes

Details Gold electroplating solutions and processes Gold electroplating solutions and processes

1978-08-07

1980-06-10

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 15, C25D 348

Patent

active

042071496

ABSTRACT:
Gold electroplating solutions, particularly useful for plating onto nickel-iron substrates, are prepared utilizing electrolytes of relatively low conductivity, such as boric acid, alkali metal and ammonium acetates, nitrates, sulfates and orthophosphates. The gold is plated onto substrates using a current density ranging from about 1 to about 2000 amperes/square foot at a temperature of about 20.degree. to about 90.degree. C.

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E. D. Winters, Plating, pp. 213-218, Mar. 1972.
B. Sewell, Trans. Inst. Met. Finish, vol. 50, No. 3, pp. 121-124, (1972).

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