Gold electroplating process

Details Gold electroplating process Gold electroplating process

1979-05-25

1980-12-09

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 348

Patent

active

042383005

ABSTRACT:
Electrolytic deposition of gold results in the formation of undesirable reducible gold III species in the electroplating bath which interfere with the current efficiency and make the prediction of gold thickness based on applied current impossible. Addition of a small quantity of hypophosphorous acid to the plating bath when the current efficiency has dropped below a certain minimum, chemically reduces accumulated gold III species and scavenges dissolved oxygen. Thus, the current efficiency is restored to about 100%. The hypophosphorous acid treatment is particularly advantageous in a phosphate buffered bath because no foreign ions are introduced into the solution.

REFERENCES:
patent: 2812299 (1957-11-01), Volk et al.
patent: 3423295 (1969-01-01), Greenspan
patent: 4067783 (1978-01-01), Okinaka et al.
E. D. Winters, Plating, pp. 213-218, Mar. 1972.

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