Gold electroplating process

Details Gold electroplating process Gold electroplating process

1977-03-21

1978-01-10

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 46G, 204290F, C25D 348, C25D 362

Patent

active

040677834

ABSTRACT:
Certain reducible species are found in gold electroplating solutions which interfere with efficient electroplating of gold and make uncertain gold thickness predictions based on current throughput. A gold electroplating process is described which minimizes formation of undesirable reducible species. This process uses an anode of titanium having a coating of the oxides of ruthenium, iridium, rhodium, titanium or mixtures thereof. In addition, a procedure is described for removing such chemical species from the gold plating bath which does not adversely affect the gold electroplating solution.

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patent: 3491014 (1970-01-01), Bianchi et al.
patent: 3616445 (1971-10-01), Bianchi et al.
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patent: 3926751 (1975-12-01), DeNora et al.
patent: 3980531 (1976-09-01), Ludwig et al.
D. Cipvis et al., J. Electroanal, Chem., 73, 125-128, (1976).
F. H. Reid et al., "Gold Plating Technology," pp. 21-52, (1974).
F. A. Lowenheim, "Modern Electroplating," pp. 224-244, (1963).

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