Gold deposition procedures and substrates upon which gold has be

Details Gold deposition procedures and substrates upon which gold has be Gold deposition procedures and substrates upon which gold has be

1974-02-25

1977-02-22

Newsome, John H.

Coating processes

Electrical product produced

Welding electrode

427252, 427304, B05D 306, C23C 1102

Patent

active

040092976

ABSTRACT:
A method for electroless gold plating in which gold ligand complexes are used; a photolytic method for depositing catalytic amounts of gold on a substrate suitable for an electroless metal deposition method whereby the gold complexes used are trivalent gold complex; a method for immersion plating or vaporization plating of gold from complexes, and complexes for the above methods.

REFERENCES:
patent: 3440113 (1969-04-01), Wolley
patent: 3537878 (1970-11-01), Baudrand et al.
patent: 3567488 (1971-03-01), Rathsack
patent: 3661959 (1972-05-01), Vaughan
Kowala et al., "Australia J. Chem.", 1966, vol. 19, pp. 539-559.

Affiliated with

Also associated with

Rating

Gold deposition procedures and substrates upon which gold has be does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gold deposition procedures and substrates upon which gold has be, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold deposition procedures and substrates upon which gold has be will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-324654