Gold conductor composition for forming conductor patterns on cer

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252518, 252519, 252521, 106 113, 106 115, 106 121, H01B 102

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051678691

ABSTRACT:
A gold conductor composition comprising by weight, basis total inorganic solids, finely divided particles of 75-95% metallic gold at least 90% by weight of which gold particle have an aspect ratio of no greater than 2, 0.5-10% cadmium borosilicate glass, 0.1-5% spinel-forming divalent metal oxide selected from the group consisting of CuO, ZnO, MgO, CoO, NiO, FeO, MnO and mixtures thereof, and 0.1-1.0% metal selected from the group consisting of palladium, platinum and rhodium, all of the foregoing particles being dispersed in an organic medium. This composition is useful in electronic packaging for forming conductor patterns on ceramic-based substrates, particularly patterns on which metallic components are bonded by brazing.

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