Gold alloy wire for bonding wire having high initial...

Details Gold alloy wire for bonding wire having high initial... Gold alloy wire for bonding wire having high initial...

2006-06-08

2010-12-28

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Solder form

C420S508000, C420S509000, C420S510000, C420S511000

Reexamination Certificate

active

07857189

ABSTRACT:
There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

REFERENCES:
patent: 2008/0050267 (2008-02-01), Murai et al.
patent: 2009/0120665 (2009-05-01), Maki et al.
patent: 2009/0232695 (2009-09-01), Maki et al.
patent: 60112251 (1994-04-01), None
patent: 8-109425 (1996-04-01), None
patent: 8-109425 (1996-04-01), None
patent: 8-193233 (1996-07-01), None
patent: 10-275820 (1998-10-01), None
patent: 10-303235 (1998-11-01), None
patent: 11-45899 (1999-02-01), None
patent: 11-45900 (1999-02-01), None
patent: 11-45901 (1999-02-01), None
patent: 11-45901 (1999-02-01), None
patent: 11214425 (1999-08-01), None
patent: 11-288962 (1999-10-01), None
patent: 2000-40710 (2000-02-01), None
Machine translation of JP-11-214425A.
Machine translation of JP-11-45901A.
Machine translation of JP-8-109425A.

Affiliated with

Also associated with

Rating

Gold alloy wire for bonding wire having high initial... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Gold alloy wire for bonding wire having high initial..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gold alloy wire for bonding wire having high initial... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4233845