Gold alloy wire and method for making a bump

Details Gold alloy wire and method for making a bump Gold alloy wire and method for making a bump

1997-05-23

2000-12-12

Wyszomierski, George

Alloys or metallic compositions

Gold base

Palladium containing

148430, C22C 502

Patent

active

061594202

ABSTRACT:
A gold alloy wire in which 0.2 to 5.0% by weight of palladium (Pd) and 1 to 100 ppm by weight of bismuth (Bi) are added to gold having a purity of at least 99.99% by weight. Preferably, at least one element selected from the group consisting of yttrium (Y), lanthanum (La), calcium (Ca) and beryllium (Be) in an amount of 3 to 250 ppm by weight is further added to said gold. The gold alloy wire is especially adapted to forming a gold bump.

REFERENCES:
patent: 4330329 (1982-05-01), Hayashi et al.
patent: 4702302 (1987-10-01), Sawada
patent: 4938923 (1990-07-01), Kujiraoka et al.
patent: 5071619 (1991-12-01), Hosoda et al.

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