Gold alloy plating compositions and method

Details Gold alloy plating compositions and method Gold alloy plating compositions and method

1976-01-15

1979-12-18

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 362

Patent

active

041793447

ABSTRACT:
Gold base alloys containing copper and cadmium are deposited from aqueous plating baths comprising an aqueous alkaline bath containing soluble gold and copper cyanide compounds, a cadmium compound, free cyanide, and an effective amount of a chelating agent capable of chelating cadmium in the presence of free cyanide. The aqueous plating baths can also advantageously contain water soluble polyoxyalkylene compounds that act as brighteners in the above gold-copper-cadmium plating baths. The water soluble polyoxyalkylene compounds also act as brighteners in the gold-copper-cadmium baths in the absence of a chelating agent.

REFERENCES:
patent: 3056733 (1962-10-01), Heilmann
patent: 3084111 (1963-04-01), Strauss et al.
patent: 3586611 (1971-06-01), Heilmann
patent: 3672969 (1972-06-01), Nobel et al.

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